Structural Configurations (Common Types)
| Type | Structure | Typical Applications |
|---|
| 1-N-1 | 1 HDI layer sequence | Wearables, Basic IoT |
| 2-N-2 | 2 HDI layers per side | Smartphones, Tablets |
| Any-layer | Micro-vias on all layers | High-end CPUs, GPUs, 5G Modules |
| ELIC | Every Layer Interconnect | Aerospace, Medical Implants |
Key Application Scenarios:
1. Consumer Electronics: Smartphones, tablets, laptops, TWS earbuds, smartwatches, AR/VR
headsets, drones.
2. Automotive Electronics: ADAS, battery management systems (BMS), in-vehicle infotainment,
central control screens.
3. Medical Devices : Pacemakers, hearing aids, handheld ultrasound devices, endoscopes.
4. Telecom & High-Performance Computing: 5G base stations, high-speed routers, data center servers, AI
accelerators.
5. Aerospace & Military Electronics: Radar systems, avionics, satellite modules, missile guidance
equipment.
FAQ:
Q: What is the brand name of this PCB product?
A: The brand name of this PCB product is High Density PCB.
Q: Where is this PCB product manufactured?
A: This PCB product is manufactured in China.
Q: What makes the High Density PCB unique?
A: The High Density PCB is known for its compact design and ability
to accommodate a high number of components within a small area.
Q: Are the High Density PCBs suitable for high-performance
electronic devices?
A: Yes, the High Density PCBs are ideal for high-performance
electronic devices due to their excellent signal integrity and
reliability.
Q: Can the High Density PCBs be customized to specific
requirements?
A: Yes, the High Density PCBs can be customized to meet specific
requirements such as size, number of layers, and material
composition.
