Product Description:
HD PCB (High Density PCB) is an advanced type of printed circuit board designed for high
component density, miniaturization, and high-performance electronic
devices.Compared to traditional PCBs, it features ultra-fine copper
traces (line widths/spacings usually ≤ 0.1mm, even down to 0.03mm),
tiny microvias (diameter ≤ 0.15mm, in blind/buried/stacked
designs), and more layers (often 8–40+ layers). It also uses
specialized materials (e.g., high-heat-resistant high-Tg FR-4,
flexible polyimide) and strict manufacturing precision to support
dense component mounting (e.g., fine-pitch chips).Widely used in
smartphones, wearables, EVs, medical implants, and 5G equipment, it
enables smaller device sizes, stable high-speed signal
transmission, and reliable operation in harsh environments.
Advantages :
1. Enables device miniaturization: Ultra-fine traces, microvias, and multi-layer designs let more
components fit in small spaces, supporting slim/portable devices
(e.g., smartwatches, thin smartphones).
2. Boosts signal performance: Low-loss materials and short microvia paths reduce signal
interference and weakening, critical for high-speed/high-frequency
devices (e.g., 5G modems, LiDAR).
3. Enhances reliability: Fewer connectors (replacing multiple traditional PCBs) and
harsh-environment-resistant substrates (e.g., high-Tg FR-4) lower
failure risks, suitable for autos/aerospace.
4. Frees up design flexibility: Supports flexible structures (foldable phones) and stacked
components (e.g., memory on CPU), easing integration of complex
functions.
5. Cuts long-term costs: Though upfront manufacturing is pricier, smaller device size,
fewer assembly steps, and less maintenance reduce overall expenses.
How is the manufacturing process of HDPCB?1.Substrate & Pre-treatment: Traditional PCBs use low-cost standard FR-4 (low Tg); HDPCBs adopt
high-performance materials (high-Tg FR-4, polyimide, PTFE) with
pre-treatment (e.g., plasma cleaning) for better adhesion and
environmental resistance.2. Trace Patterning: Traditional PCBs use standard photolithography for ≥0.15mm traces;
HDPCBs rely on high-resolution laser direct imaging (LDI) to make
≤0.03mm fine traces, with thinner copper layers (0.5–1 oz) and
precise micro-etching.3. Via Drilling: Traditional PCBs use mechanical drilling for ≥0.2mm through-holes;
HDPCBs use laser drilling to create ≤0.15mm microvias
(blind/buried/stacked), saving space.4. Layer Lamination: Traditional PCBs laminate 2–4 layers with loose alignment
(≥0.05mm); HDPCBs bond 8–40+ layers via high-precision alignment
(≤0.01mm) and controlled heat/pressure to avoid warping.5. Component Mounting: Traditional PCBs use through-hole mounting or standard SMT (≥0.8mm
pitch); HDPCBs use fine-pitch SMT (≤0.5mm pitch) with high-accuracy
placement machines, plus nitrogen reflow to prevent solder defects.6. QC: Traditional PCBs use basic AOI; HDPCBs add 3D AOI, X-ray
inspection (for microvias), and signal integrity testing to detect
tiny defects.
