High-frequency PCB
Our High-Frequency Printed Circuit Board (PCB) is precision-manufactured for demanding applications in RF,
microwave, 5G communication, radar systems, satellite technology,
and high-speed digital circuits. Designed to minimize signal loss,
maintain impedance integrity, and ensure stable performance at
GHz-level frequencies, this PCB is ideal for engineers and
manufacturers in advanced electronic fields.Whether you're
developing 5G base stations, automotive radar, or high-speed data
transmission modules, our high-frequency PCB delivers exceptional
dielectric performance, low insertion loss, and consistent signal
integrity.
Brief Description of HDI PCB Advantages
1.High Wiring Density: Achieved through the use of Microvias (tiny, laser-drilled holes)
and finer lines/spaces. This allows for significantly more
circuitry in a smaller area, maximizing space utilization.
2. Superior Electrical Performance: The shorter trace lengths and optimized stack-up inherent in HDI
designs lead to better signal integrity, reduced signal latency,
and improved impedance control, which is crucial for high-speed
digital circuits.
3. Miniaturization and Weight Reduction: By increasing integration, HDI boards enable the design of
smaller, lighter, and thinner final products, making them ideal for
smartphones, wearables, and other portable devices.
4. Support for Advanced Packaging: They can accommodate components with very fine pitch, such as BGAs
(Ball Grid Arrays) and CSPs (Chip-Scale Packages), often using
Via-in-Pad technology for better component mounting reliability.
Ordering InformationPlease send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
We’ll reply within 4 hours with a free quote, DFM report, and
material recommendation.
Manufacturing process:
- Design Phase: During the design phase, specialized PCB design software is
required to take into account the characteristics of high-frequency
signal transmission, while conducting precise impedance control and
signal integrity analysis.
- Material selection and manufacturing: High-frequency PCBs typically use special high-frequency materials
such as PTFE, ceramics, or LCP. These materials require processing
during manufacturing to ensure stable electrical performance.
- Etching and pattern transfer: The circuit pattern of high-frequency PCB is transferred to the
copper layer through photolithography and etching technology. In
this, the width and spacing of the lines need to be strictly
controlled to ensure the stability of signal transmission.
- Via and interlayer connection: The via design of high-frequency PCBs requires great precision,
using tiny vias and appropriate plating processes to ensure the
transmission of signals.
- Assembly and testing: After the completion of the PCB manufacturing, the components are
installed and soldered. High-frequency PCBs need to undergo strict
testing to their performance under high-frequency working
conditions, including signal integrity, impedance control, and
thermal management, etc.
