XingQiang HDI Thick Copper Multilayer PCB
XingQiang delivers premium custom high-density multilayer PCBs with
outstanding advantages in technology, delivery, and after-sales
service. We specialize in HDI, blind and buried vias, fine pitch
BGA, impedance control, and high-speed signal designIdeal for
medical, aerospace, industrial, and high-end electronic devices,
our PCBs adhere to strict quality standards, ensuring excellent
thermal management, signal stability, and consistent performance
for prototype and mass production.
Why Choose Custom Circuit Boards Over Off-the-Shelf Boards?
| Item | Custom Circuit Boards | Standard Off-the-Shelf Boards |
|---|
| Size & Structure | Fully customized to fit your device; free to define dimensions,
holes and connectors | Fixed size, hard to match special structures |
| Function & Interfaces | Custom interface types, quantity and layout as needed | Fixed interfaces, often insufficient or redundant |
| Performance | Optimized for high-speed, high-density and anti-interference
requirements | Generic design, hard to meet high-performance standards |
| Integration | Highly integrated, compact size, improves product competitiveness | Bulky with redundant parts, not ideal for miniaturization |
| Cost Efficiency | Lower material cost in mass production; fewer adapters needed | Extra modification & adapter costs, higher overall expense |
| IP Protection | Exclusive design protects your circuit and product IP | Universal design, easy to copy, no differentiation |
| Upgrades | Flexible and fast revisions for product iteration | Fixed layout, limited upgrade, high modification cost |
How to customize your HDI Printed Circuit Boards?
Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)
Normally Gerber files Include:PCB Types,Product thickness, Ink
color, Surface treatment process and SMT requirement.
We’ll reply within 24 hours with a free quote, DFM report, and
material recommendation.
Manufacturing Challenges of Advanced Multilayer HDI Circuit Boards:
- High-layer count structure leads to complicated lamination and
interlayer alignment control.
- Microvia and fine-pitch design requires laser drilling accuracy and
stable etching technology.
- High-speed signals need strict impedance matching to avoid
crosstalk and transmission errors.
- Thermal management is critical to prevent layer separation and
performance degradation.
- Strict quality testing including short/open circuit check and
reliability test adds production complexity.
Factory showcase
PCB Quality Testing
Certificates and Honors
