Red oil solder mask + double-sided gold immersion combination: The red ink offers stable insulation and distinct visual differentiation, while the nickel-gold composite layer on pads ensures reliable soldering performance with strong adhesion and uniform thickness.​

Double-sided wiring structure: Supports bidirectional signal transmission, adapting to standard electronic device layouts and meeting small to medium-scale circuit design needs.​

Process compatibility: The integration of red oil solder mask and gold immersion is stable, with good material compatibility, fitting into conventional production workflows.

Superior soldering reliability: The gold layer on pads has excellent oxidation resistance and conductivity, ensuring consistent solder wetting, reducing cold solder joint risks, and being ideal for precision components such as BGA and QFP.​

Clear identification and robust protection: The red solder mask simplifies production inspection and fault diagnosis through visual distinction; it also isolates circuits from external environments, enhancing corrosion resistance and extending the board’s service life.​

High-frequency performance: The flat gold layer surface minimizes signal transmission loss, making it suitable for high-frequency scenarios in communication equipment and medical instruments.​

Balanced cost and performance: Compared to high-end surface treatments, it maintains good performance with relatively controllable costs, suitable for fields requiring precision and clear identification, such as consumer electronics and industrial control.