This 8-panel double-sided printed circuit board (PCB) features gold-plated pads, fine-pitch FPC connectors, and precision routing for compact electronic modules. Ideal for IoT, sensor, or embedded system prototyping, it offers reliable solderability, consistent signal integrity, and mass-production-ready panelization. Manufactured with strict quality control, it supports custom SMT assembly and is perfect for R&D, small-batch production, and electronic component testing.

• 8-in-1 panel design for efficient SMT assembly, cutting production time & labor cost
• Gold-plated pads & FR-4 substrate for excellent solderability, oxidation resistance & long-term reliability
• High-precision fine-pitch routing for stable signal transmission, ideal for compact modules
• Versatile for prototyping & mass production, compatible with custom SMT assembly
• Standardized process reduces waste, lowers unit cost & ensures consistent quality

Gerber files, NC drill files, centroid/Pick and Place files, and BOM list.

Overall dimension drawing, assembly diagram, FPC/connector positioning details, and silkscreen description.

Board thickness, layer count, surface finishing (gold plating etc.), trace width/spacing, and impedance control requirements.

Panelization design, SMT assembly requirements, testing standards, order quantity, and packaging specifications.